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Volumn 5752, Issue I, 2005, Pages 127-139

The role of AFM in semiconductor technology development: The 65 nm technology node and beyond

Author keywords

AFM; CD; Critical dimensions; Sample to sample bias variation; Total measurement uncertainty

Indexed keywords

CHEMICAL MECHANICAL POLISHING; INTEGRATED CIRCUITS; LIGHT SCATTERING; MEASUREMENT THEORY; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; TRANSMISSION ELECTRON MICROSCOPY;

EID: 24644454713     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.602758     Document Type: Conference Paper
Times cited : (34)

References (18)
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    • Rice, B.J.1
  • 2
    • 24644459661 scopus 로고    scopus 로고
    • note
    • The transistor designers usually use the "gate length" term for the gate CD or for the poly-Si line width and the "gate width" term for the third gate dimension along the gate or along the poly-Si line.
  • 4
    • 0141835012 scopus 로고    scopus 로고
    • Effect of bias variation on total uncertainty of CD measurements
    • V. A. Ukraintsev, "Effect of bias variation on total uncertainty of CD measurements," Proceedings SPIE 5038, pp. 644-650, 2003.
    • (2003) Proceedings SPIE , vol.5038 , pp. 644-650
    • Ukraintsev, V.A.1
  • 5
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    • Reference metrology using a next generation CD-AFM
    • R. Dixon, A. Guerry, "Reference Metrology using a Next Generation CD-AFM," Proceedings SPIE 5375, pp. 633-646, 2004.
    • (2004) Proceedings SPIE , vol.5375 , pp. 633-646
    • Dixon, R.1    Guerry, A.2
  • 6
    • 0005007730 scopus 로고    scopus 로고
    • Scanned probe microscope dimensional metrology
    • edited by A. C. Diebold, Marcel Dekker, Inc., New York
    • H. M. Marchman, J. E. Griffith, "Scanned Probe Microscope Dimensional Metrology," in Handbook of Silicon Semiconductor Metrology, edited by A. C. Diebold, Marcel Dekker, Inc., New York, 2001, pp. 335-376.
    • (2001) Handbook of Silicon Semiconductor Metrology , pp. 335-376
    • Marchman, H.M.1    Griffith, J.E.2
  • 8
    • 0032680498 scopus 로고    scopus 로고
    • TIS, AFM, interferometry, and optical profiler correlation of surface roughness on silicon wafers
    • P. A. Taylor, D. J. Dawson, "TIS, AFM, Interferometry, and Optical Profiler Correlation of Surface Roughness on Silicon Wafers," Proceedings SPIE 3619, pp. 128-133, 1999.
    • (1999) Proceedings SPIE , vol.3619 , pp. 128-133
    • Taylor, P.A.1    Dawson, D.J.2
  • 9
    • 24644435772 scopus 로고    scopus 로고
    • note
    • The best lifetime and XY resolution has been achieved with carbon nanotube probes. Silicon probes provide comparable resolution but have shorter lifetime.
  • 10
    • 24644437186 scopus 로고    scopus 로고
    • note
    • Some progress on the nature of probe-to-sample interaction is definitely needed and long time expected. Our knowledge of physics and chemistry of probe-to-sample interaction is not adequate to the challenge CD AFM is facing.
  • 11
    • 0141723694 scopus 로고    scopus 로고
    • A simulation study of repeatability and bias in the CD-SEM
    • J. S. Villarrubia, A. E. Vladaśr, M. T. Postek, "A Simulation Study of Repeatability and Bias in the CD-SEM," Proceedings SPIE 5038, pp. 138-149, 2003.
    • (2003) Proceedings SPIE , vol.5038 , pp. 138-149
    • Villarrubia, J.S.1    Vladaśr, A.E.2    Postek, M.T.3
  • 12
    • 0141835067 scopus 로고    scopus 로고
    • Scatterometry measurement precision and accuracy below 70 nm
    • M. Sendelbach, C. Archie, "Scatterometry measurement precision and accuracy below 70 nm," Proceedings SPIE 5038, pp. 224-238, 2003.
    • (2003) Proceedings SPIE , vol.5038 , pp. 224-238
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  • 13
    • 0141723536 scopus 로고    scopus 로고
    • Specifications and methodologies for benchmarking of advanced CD-SEMs at the 90nm CMOS technology node and beyond
    • B. D. Bunday, M. Bishop, "Specifications and Methodologies for Benchmarking of Advanced CD-SEMs at the 90nm CMOS Technology Node and Beyond," Proceedings SPIE 5038, pp. 1038-1052, 2003.
    • (2003) Proceedings SPIE , vol.5038 , pp. 1038-1052
    • Bunday, B.D.1    Bishop, M.2
  • 14
    • 24644510584 scopus 로고    scopus 로고
    • note
    • The Mandel regression analysis [12] has been used on the data presented in Fig. 14. Assuming TMU of the reference measurement system (CD AFM) of 2.0 nm (3σ) the TMU of the OCD equal to 1.45 nm (3σ) has been obtained. Using the OCD precision of 0.5 nm (3σ) bias variation of 1.36 nm (3σ) is calculated (cf. Table 1).
  • 15
    • 24644448632 scopus 로고    scopus 로고
    • note
    • The impact of STI step height on gate CD is mainly due to consumption of gate lithography focus margin.
  • 16
    • 0141611970 scopus 로고    scopus 로고
    • CD-SEM measurement of line edge roughness test patterns for 193 nm lithography
    • B. B. Bunday, M. Bishop, J. S. Villarrubia, A. E. Vladár, "CD-SEM Measurement of Line Edge Roughness Test Patterns for 193 nm Lithography," Proceedings SPIE 5038, pp.674-688, 2003.
    • (2003) Proceedings SPIE , vol.5038 , pp. 674-688
    • Bunday, B.B.1    Bishop, M.2    Villarrubia, J.S.3    Vladár, A.E.4
  • 17
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    • Nondestructive via in-hole profile characterization using atomic force microscopy metrology
    • A. Ali, V. Ukraintsev, H. Sabri, M. Yang, "Nondestructive via in-hole profile characterization using atomic force microscopy metrology," JVST, B20(1), pp. 95-99, 2002.
    • (2002) JVST , vol.B20 , Issue.1 , pp. 95-99
    • Ali, A.1    Ukraintsev, V.2    Sabri, H.3    Yang, M.4
  • 18
    • 24644455786 scopus 로고    scopus 로고
    • Dimensional metrology challenges for ULSI interconnects
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    • R. Havemann et al., "Dimensional Metrology Challenges for ULSI Interconnects," Proceedings of Characterization and Metrology for ULSI Technology, AIP conference proceedings Vol. 449, pp. 377-384, 1998.
    • (1998) AIP Conference Proceedings , vol.449 , pp. 377-384
    • Havemann, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.