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1
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4344562122
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CD metrology for the 45 nm and 32 nm nodes
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Bryan J. Rice et al, "CD Metrology for the 45 nm and 32 nm Nodes," Proceedings SPIE 5375, pp. 183-190, 2004.
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(2004)
Proceedings SPIE
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Rice, B.J.1
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2
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24644459661
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note
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The transistor designers usually use the "gate length" term for the gate CD or for the poly-Si line width and the "gate width" term for the third gate dimension along the gate or along the poly-Si line.
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4
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0141835012
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Effect of bias variation on total uncertainty of CD measurements
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V. A. Ukraintsev, "Effect of bias variation on total uncertainty of CD measurements," Proceedings SPIE 5038, pp. 644-650, 2003.
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(2003)
Proceedings SPIE
, vol.5038
, pp. 644-650
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Ukraintsev, V.A.1
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5
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4344592070
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Reference metrology using a next generation CD-AFM
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R. Dixon, A. Guerry, "Reference Metrology using a Next Generation CD-AFM," Proceedings SPIE 5375, pp. 633-646, 2004.
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(2004)
Proceedings SPIE
, vol.5375
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Dixon, R.1
Guerry, A.2
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6
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0005007730
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Scanned probe microscope dimensional metrology
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edited by A. C. Diebold, Marcel Dekker, Inc., New York
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H. M. Marchman, J. E. Griffith, "Scanned Probe Microscope Dimensional Metrology," in Handbook of Silicon Semiconductor Metrology, edited by A. C. Diebold, Marcel Dekker, Inc., New York, 2001, pp. 335-376.
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(2001)
Handbook of Silicon Semiconductor Metrology
, pp. 335-376
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Marchman, H.M.1
Griffith, J.E.2
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7
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4344703200
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Improved etch and CMP process control using in-line AFM
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T. Trenkler, T. Kraiss, U. Maintz, P. Weidner, R. H. Pinto, "Improved Etch and CMP Process Control Using In-Line AFM," Proceedings SPIE 5375, pp. 486-493, 2004.
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(2004)
Proceedings SPIE
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Trenkler, T.1
Kraiss, T.2
Maintz, U.3
Weidner, P.4
Pinto, R.H.5
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8
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0032680498
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TIS, AFM, interferometry, and optical profiler correlation of surface roughness on silicon wafers
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P. A. Taylor, D. J. Dawson, "TIS, AFM, Interferometry, and Optical Profiler Correlation of Surface Roughness on Silicon Wafers," Proceedings SPIE 3619, pp. 128-133, 1999.
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(1999)
Proceedings SPIE
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, pp. 128-133
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Taylor, P.A.1
Dawson, D.J.2
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9
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24644435772
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note
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The best lifetime and XY resolution has been achieved with carbon nanotube probes. Silicon probes provide comparable resolution but have shorter lifetime.
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10
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24644437186
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note
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Some progress on the nature of probe-to-sample interaction is definitely needed and long time expected. Our knowledge of physics and chemistry of probe-to-sample interaction is not adequate to the challenge CD AFM is facing.
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11
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0141723694
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A simulation study of repeatability and bias in the CD-SEM
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J. S. Villarrubia, A. E. Vladaśr, M. T. Postek, "A Simulation Study of Repeatability and Bias in the CD-SEM," Proceedings SPIE 5038, pp. 138-149, 2003.
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Villarrubia, J.S.1
Vladaśr, A.E.2
Postek, M.T.3
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12
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0141835067
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Scatterometry measurement precision and accuracy below 70 nm
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M. Sendelbach, C. Archie, "Scatterometry measurement precision and accuracy below 70 nm," Proceedings SPIE 5038, pp. 224-238, 2003.
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(2003)
Proceedings SPIE
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Sendelbach, M.1
Archie, C.2
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13
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0141723536
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Specifications and methodologies for benchmarking of advanced CD-SEMs at the 90nm CMOS technology node and beyond
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B. D. Bunday, M. Bishop, "Specifications and Methodologies for Benchmarking of Advanced CD-SEMs at the 90nm CMOS Technology Node and Beyond," Proceedings SPIE 5038, pp. 1038-1052, 2003.
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(2003)
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Bunday, B.D.1
Bishop, M.2
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14
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24644510584
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note
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The Mandel regression analysis [12] has been used on the data presented in Fig. 14. Assuming TMU of the reference measurement system (CD AFM) of 2.0 nm (3σ) the TMU of the OCD equal to 1.45 nm (3σ) has been obtained. Using the OCD precision of 0.5 nm (3σ) bias variation of 1.36 nm (3σ) is calculated (cf. Table 1).
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15
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24644448632
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note
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The impact of STI step height on gate CD is mainly due to consumption of gate lithography focus margin.
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16
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0141611970
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CD-SEM measurement of line edge roughness test patterns for 193 nm lithography
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B. B. Bunday, M. Bishop, J. S. Villarrubia, A. E. Vladár, "CD-SEM Measurement of Line Edge Roughness Test Patterns for 193 nm Lithography," Proceedings SPIE 5038, pp.674-688, 2003.
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(2003)
Proceedings SPIE
, vol.5038
, pp. 674-688
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Bunday, B.B.1
Bishop, M.2
Villarrubia, J.S.3
Vladár, A.E.4
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17
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0036120998
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Nondestructive via in-hole profile characterization using atomic force microscopy metrology
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A. Ali, V. Ukraintsev, H. Sabri, M. Yang, "Nondestructive via in-hole profile characterization using atomic force microscopy metrology," JVST, B20(1), pp. 95-99, 2002.
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(2002)
JVST
, vol.B20
, Issue.1
, pp. 95-99
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Ali, A.1
Ukraintsev, V.2
Sabri, H.3
Yang, M.4
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18
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24644455786
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Dimensional metrology challenges for ULSI interconnects
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Proceedings of Characterization and Metrology for ULSI Technology
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R. Havemann et al., "Dimensional Metrology Challenges for ULSI Interconnects," Proceedings of Characterization and Metrology for ULSI Technology, AIP conference proceedings Vol. 449, pp. 377-384, 1998.
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(1998)
AIP Conference Proceedings
, vol.449
, pp. 377-384
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Havemann, R.1
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