Improved etch and CMP process control using in-line AFM

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5375, Issue PART 1, 2004, Pages 486-493

  Trenkler, Thomas ^a   Kraiss, Thomas ^a   Mantz, Ulrich ^a   Weidner, Peter ^a   Pinto, Rebecca Howland ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

AFM; After etch; In line metrology; Line monitoring; Post CMP; STI; Trench capacitor; Trench depth

Indexed keywords

IN-LINE METROLOGY; LINE MONITORING; TRENCH CAPACITORS; TRENCH DEPTH;

ATOMIC FORCE MICROSCOPY; CAPACITORS; ETCHING; FAILURE ANALYSIS; MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY;

PROCESS CONTROL;

EID: 4344703200     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.535967     Document Type: Conference Paper

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