The effect of solder bump pitch on the underfill flow

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 4, 2002, Pages 537-542

  Young, Wen Bin ^a   Yang, Wen Lin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b National Ping Tung Institute of Commerce   (Taiwan)

Author keywords

Bump pitch; Capillary flow; Flip chip; Underfill; Underfill flow

Indexed keywords

CAPILLARY FLOW; ENCAPSULATION; OPTICAL INTERCONNECTS; SOLDERED JOINTS;

BUMP PITCH;

FLIP CHIP DEVICES;

EID: 0036881383     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.807564     Document Type: Article

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