Micro-channel filling flow considering surface tension effect

Journal of Micromechanics and Microengineering

Volumn 12, Issue 3, 2002, Pages 236-246

  Kim, Dong Sung ^a   Lee, Kwang Cheol ^a   Kwon, Tai Hun ^a   Lee, Seung S ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FILLING; FLOW VISUALIZATION; FLUIDIC DEVICES; NUMERICAL ANALYSIS; SEMICONDUCTING SILICON; SUBSTRATES; SURFACE TENSION;

MICROCHANNEL FILLING;

INJECTION MOLDING;

EID: 0036572852     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/3/307     Document Type: Article

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