Effect of slurry surfactant on nanotopography impact in chemical mechanical polishing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 9 A, 2003, Pages 5430-5432

  Katoh, Takeo ^a   Kim, Sung Jun ^a   Paik, Ungyu ^a   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

Author keywords

Ceria; CMP; Nanotopography; Power spectral density; Slurry; STI; Surfactant

Indexed keywords

CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; COMPOSITION EFFECTS; SURFACE ACTIVE AGENTS; SURFACE TOPOGRAPHY; THICKNESS MEASUREMENT;

ANIONIC ORGANIC SURFACTANT; NANOTOPOGRAPHY IMPACT; POWER SPECTRAL DENSITY;

SLURRIES;

EID: 0344063457     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.5430     Document Type: Article

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