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Volumn 40, Issue 1, 2002, Pages 180-183

Effects of film type and nanotopography of wafers on oxide CMP characteristics

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0036002428     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper
Times cited : (16)

References (15)
  • 1
    • 0000058079 scopus 로고
    • Santa Clara, CA, June
    • S. Pennington and S. Luce, VMIC Conf., Santa Clara, CA, June 1992, pp. 168-172.
    • (1992) VMIC Conf. , pp. 168-172
    • Pennington, S.1    Luce, S.2
  • 10
    • 0012008615 scopus 로고    scopus 로고
    • Intel Corp., Wafer Flatness Requirements for Future Technology, Summer
    • K.V. Ravi, Intel Corp., Wafer Flatness Requirements for Future Technology, Future Fab. International, Summer, (1999).
    • (1999) Future Fab. International
    • Ravi, K.V.1
  • 13
    • 0011946157 scopus 로고    scopus 로고
    • A Guide for Reporting Wafer Nanotopography
    • SEMI Draft Document 3089, A Guide for Reporting Wafer Nanotopography.
    • SEMI Draft Document , pp. 3089


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.