Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 43, Issue 1 A/B, 2004, Pages

  Kang, Hyun Goo ^a   Katoh, Takeo ^a   Lee, Won Mo ^a   Paik, Ungyu ^a   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

Author keywords

Abrasive; CMP; Concentration; Nanotopography; Oxide film; Shallow trench isolation; Size; Surfactant

Indexed keywords

ABRASIVES; ADDITION REACTIONS; CERIUM COMPOUNDS; NANOTECHNOLOGY; OXIDATION; PASSIVATION; SLURRIES; SURFACE ACTIVE AGENTS; VISCOMETERS; VISCOSITY;

ABRASIVE SIZE; CMP; CONCENTRATION; NANOTOPOGRAPHY; OXIDE FILMS; SHALLOW TRENCH ISOLATION (STI);

CHEMICAL MECHANICAL POLISHING;

EID: 1842659067     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.L1     Document Type: Article

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