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Volumn , Issue , 2004, Pages 768-773

Physical CAD changes to incorporate design for lithography and manufacturability

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL GEOMETRY; COMPUTER AIDED DESIGN; ETCHING; LIGHT; MICROPROCESSOR CHIPS; PRINTED CIRCUIT DESIGN;

EID: 2442425210     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (28)

References (15)
  • 1
    • 0025388399 scopus 로고
    • Computer-aided design for VLSI circuit manufacturability
    • W. Maly, "Computer-aided design for VLSI circuit manufacturability", Proceedings of IEEE, 78 (1990), pp. 356-392.
    • (1990) Proceedings of IEEE , vol.78 , pp. 356-392
    • Maly, W.1
  • 3
    • 0032674029 scopus 로고    scopus 로고
    • Subwavelength Lithography and its Potential Impact on Design and EDA
    • Andrew B. Kahng, Y. C. Pati "Subwavelength Lithography and its Potential Impact on Design and EDA", Design Automation Conference, 1999, pp. 799-804.
    • (1999) Design Automation Conference , pp. 799-804
    • Kahng, A.B.1    Pati, Y.C.2
  • 6
    • 2442463119 scopus 로고    scopus 로고
    • Relaxed rules proposed for early 65-nm processes
    • July 29
    • David Lammers and Ron Wilson, "Relaxed rules proposed for early 65-nm processes", EE Times, July 29, 2002.
    • (2002) EE Times
    • Lammers, D.1    Wilson, R.2
  • 7
    • 2442435553 scopus 로고    scopus 로고
    • Intel drops 157 litho from roadmap
    • May 2.3
    • David Lammers "Intel drops 157 litho from roadmap", EE Times, May 23, 2003
    • (2003) EE Times
    • Lammers, D.1
  • 12
    • 28744454436 scopus 로고    scopus 로고
    • Numerical modeling and characterization of the stress migration behavior upon various 90 nanometer Cu/Low k interconnects
    • T.C. Huang, C.H. Yao, W.K. Wan, C.C. Hsia and M.S. Liang, "Numerical Modeling and Characterization of the Stress Migration Behavior Upon Various 90 Nanometer Cu/Low k Interconnects", IEEE International Interconnect Technology Conference, 2003, pp. 207-209.
    • (2003) IEEE International Interconnect Technology Conference , pp. 207-209
    • Huang, T.C.1    Yao, C.H.2    Wan, W.K.3    Hsia, C.C.4    Liang, M.S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.