A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces

Microsystem Technologies

Volumn 11, Issue 7, 2005, Pages 526-534

  Dai, Wen ^a   Lian, Kun ^a   Wang, Wanjun ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRYSTAL ATOMIC STRUCTURE; CURING; DRY ETCHING; EPOXY RESINS; LIGHT SOURCES; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NANOTECHNOLOGY; PHOTORESISTORS; SURFACE PHENOMENA; SYNCHROTRON RADIATION; ULTRAVIOLET RADIATION; X RAY LITHOGRAPHY;

ELECTRON CONFIGURATIONS; METALLIC SURFACES; MICROFABRICATION; ULTRAVIOLET LITHOGRAPHY;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 23844517167     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0587-4     Document Type: Review

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