Exploiting defect clustering for yield and reliability prediction

IEE Proceedings: Computers and Digital Techniques

Volumn 152, Issue 3, 2005, Pages 407-413

  Barnett, T S ^a   Grady, M ^a   Purdy, K ^a   Singh, A D ^b  

^a IBM MICROELECTRONICS   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; FAILURE ANALYSIS; PROBABILITY; RANDOM PROCESSES; RELIABILITY THEORY; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS;

BINOMIAL DISTRIBUTION; DEFECT-FREE CHIPS; LATENT DEFECTS; WAFER PROBES;

MICROPROCESSOR CHIPS;

EID: 22944463018     PISSN: 13502387     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ip-cdt:20045056     Document Type: Conference Paper

References (14)

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