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Volumn 36, Issue 4-5, 1996, Pages 235-242
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Preparation of soft solder joints
a
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Author keywords
[No Author keywords available]
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Indexed keywords
DIMENSIONAL STABILITY;
ELECTRONIC EQUIPMENT;
INTEGRATED CIRCUITS;
INTERFACES (MATERIALS);
PHASE TRANSITIONS;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
FILIGREE GEOMETRIES;
SOFT SOLDER;
SOLDERED JOINTS;
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EID: 0030114291
PISSN: 10445803
EISSN: None
Source Type: Journal
DOI: 10.1016/S1044-5803(96)00055-1 Document Type: Article |
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Times cited : (3)
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References (0)
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