A mechanical reliability assessment of solder joints

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 8-14

  Kishimoto, K ^a   Omiya, M ^a   Amagai, M ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Texas Instrument Japan Limited   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; GOLD DEPOSITS; INTERMETALLICS; LEAD; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; NICKEL; PACKAGING MATERIALS; RELIABILITY; SOLDERING ALLOYS; TENSILE TESTING; TIN ALLOYS;

EDX MICROPROBE ANALYSIS; ELECTRICAL PADS; ISOTHERMAL CHAMBER; MECHANICAL RELIABILITY; REFLOW PROCESS; SOLDER JOINTS; SOLDER-JOINT STRENGTH; STRESS CONDITION;

TIN;

EID: 84960345553     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983948     Document Type: Conference Paper

References (11)

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