Mechanism for ohmic contact formation of Ni/Ag contacts on p-type GaN

Applied Physics Letters

Volumn 85, Issue 24, 2004, Pages 5920-5922

  Jang, Ho Won ^a   Lee, Jong Lam ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; LIGHT EMITTING DIODES; PHOTOEMISSION; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTING GALLIUM COMPOUNDS; SYNCHROTRONS; X RAY DIFFRACTION;

OHMIC CONTACT FORMATION; SYNCHROTRON RADIATION PHOTOEMISSION SPECTROSCOPY (SRPES); TRANSMISSION LINE METHOD (TLM); VERTICAL-STRUCTURE DESIGNS;

NICKEL;

EID: 20444479833     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1835535     Document Type: Article

References (16)

1. J. J. Wierer, D. A. Steigerwald, M. R. Krames, J. J. O'Shea, M. J. Ludowise, N. F. Gardner, R. S. Kern, and S. A. Stockman, Appl. Phys. Lett. 78, 3379 (2001).
2. W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, Appl. Phys. Lett. 77, 2822 (2000).
3. T. Fujii, Y. Gao, R. Sharma, E. L. Hu, S. P. DenBaars, and S. Nakamura, Appl. Phys. Lett. 84, 855 (2004).
4. H. W. Jang, H. K. Yu, S. W. Ryu, and J.-L. Lee, Proceeding of the 2004 International Workshop on Nitride Semiconductors., Pittsburgh, PA, 19-23 July, 2004, p. 24.
5. J.-O. Song, D.-S. Leem, J. S. Kwak, O. H. Nam, Y. Park, and T.-Y. Seong, Appl. Phys. Lett. 83, 4990 (2003).
6. D. L. Hibbard, S. P. Jung, C. Wang, D. Ullery, Y. S. Zhao, H. P. Lee, W. So, and H. Liu, Appl. Phys. Lett. 83, 311 (2003).
7. S. Y. Kim and J.-L. Lee, Electrochem. Solid-State Lett. 7, G102 (2004).
8. V. Adivarahan, A. Lunev, M. A. Khan, J. Yang, G. Simin, M. S. Shur, and R. Gaska, Appl. Phys. Lett. 78, 2781 (2001).
9. J. K. Kim, J. L. Lee, J. W. Lee, H. E. Shin, Y. J. Park, and T. Kim, Appl. Phys. Lett. 73, 2953 (1998).
10. S. C. Ahn, S. Y. Han, J. L. Lee, J. H. Moon, and B. T. Lee, Met. Mater. Int. 0309-1902 10, 103 (2004).
11. J.-S. Jang and T.-Y. Seong, J. Appl. Phys. 88, 3064 (2000).
12. H. W. Jang, J. M. Baik, M. K. Lee, H. J. Shin, and J.-L. Lee, J. Electrochem. Soc. 151, G536 (2004).
13. H. W. Jang, S. Y. Kim, and J.-L. Lee, J. Appl. Phys. 94, 1748 (2003).
14. Y.-J. Lin, Appl. Phys. Lett. 84, 2760 (2004).
15. T. B. Massalski, H. Okamoto, P. R. Subramanian, and L. Kapcprzak, Binary Alloy Phase Diagrams, 2nd ed. (International, Materials Park, OH, 1990), Vol. 1, p. 38.
16. F. R. de Boer, R. Boom, W. C. M. Mattens, A. R. Miedema, and A. K. Nielsen, Cohesion in Metals (North-Holland, Amsterdam, 1989).