Unique phase changes induced by electromigration (EM) in solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 71-76

  Gan, H ^a   Xu, G ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REACTIONS; ELECTROMIGRATION; PHASE COMPOSITION; POLARIZATION; SOLDERING;

EUTECTIC COMPOSITION; SOLDER COMPOSITION; SOLDER JOINTS;

MICROELECTRONICS;

EID: 0037675715     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. Tu, K. N., Gusak, A. M., and Li, M., "Physics and Materials Challenges for Pb-free Solders," J. Appl. Phys., Vol. 93 (2003), pp. 1335-1342.
2. Brandenburg, S. and Yeh, S., "Electromigration Studies of Flip Chip Bump Solder Joints," Proceedings of Surface Mount International Conference and Exhibition, SMI98, San Jose, CA, Aug. 1998, pp. 337-344.
3. Liu, C. Y., Chen, C., Liao, C. N. and Tu, K. N., "Microstructure-electromigration Correlation in a Thin Stripe of Eutectic SnPb Solder Stressed between Cu Electrodes," Appl. Phys. Lett., Vol.75, No. 1 (1999), pp. 58-60.
4. Liu, C. Y., Chen, C., and Tu, K. N., "Electromigration of Thin Strips of SnPb Solder as a Function of Composition," J. Appl. Phys., Vol.88 (2000), pp. 5703-5709.
5. Huynh, Q. T., Liu, C. Y., Chen, C., and Tu, K. N., "Electromigration in Eutectic PbSn Solder Lines," J. Appl. Phys., Vol.89 (2001), pp. 4332-4335.
6. Lee, T. Y., Tu, K. N., Kuo, S. M., and Frear, D. R., "Electromigration of Eutectic SnPb Solder Interconnects for Flip Chip Technology," J. Appl. Phys., Vol.89 (2001), pp. 3189-3194.
7. Lee, T. Y., Tu, K. N., and Frear, D. R., "Electromigration of Eutectic SnPb and SnAgCu Flip Chip Solder Bumps and Under-bump-metallization," J. Appl. Phys., Vol. 90 (2001), pp. 4502-4508.
8. Yeh, E. C. C., Choi, W. J., Tu, K. N., Elenius, P., and Balkan, H., "Current crowding-induced Electromigration Failure in Flip Chip Solder Joints," Appl. Phys. Lett., Vol. 80, No. 4 (2002), pp. 580-582.
9. Gan, H., Choi, W. J., Xu, G., and Tu, K. N., "Electromigration in Solder Joints and Solder Lines," JOM, Vol. 54, No. 6, (2002), pp. 34-37.
10. Gan, H., and Tu, K. N., "Effect of Electromigration on Intermetallic Compound Formation in Pb-free Solder-Cu Interfaces," Proc 52th Electronic Components and Technology Conf, San Diego, CA, May, 2002, pp. 1206-1212.
11. Choi, W. J., Yeh, E. C. C., and Tu, K. N., "Electromigration of Flip Chip Solder Bump on Cu/Ni(V)/Al Thin Film Under Bump Metallization," Proc 52th Electronic Components and Technology Conf, San Diego, CA, May, 2002, pp. 1201-1205.
12. Zeng, K., and Tu, K. N., "Six Cases of Reliability Study of Pb-free Solder Joints in Electron Packaging Technology," Materials Science and Engineering Reports, R38 (2002), pp. 55-105.
13. Gjostein, N. A., "Short Circuit Diffusion," Diffusion, edited by Aaronson, H. I. et al, American Society for Metals, (Metals Park, OH, 1973), pp. 241-274.
14. Wynblatt, P., and Gjostein, N. A., "A Calculation of Relaxation, Migration and Formation Energies for Surface Defects in Copper," Surface Sci., Vol.12, No.2 (1968), pp.109-127.
15. Gupta, D., Vieregge, K. and Gust, W., "Interface Diffusion in Eutectic Pb-Sn Solder.," Acta Materialia, Vol. 47, No.1 (1998), pp. 5-12.
16. Xu, G., "Effect of Electromigration in V-shaped Solder Line," Master Thesis, UCLA, 2001.
17. Tu, K. N., and Rosenberg, R., "Room-Temperature Interaction in Bimetallic Thin-Film Couples," Japan J. of Appl. Phys., Vol.2, No.1 (1974), pp. 633-636.
18. Chen S. W., Chen, C. M., and Liu, W. C., "Electric Current Effect Upon the Sn/Cu and Sn/Ni Interfacial Reactions," J. Electron. Mater. Vol.27, No. 11 (1998), pp. 1193-1198.