Variation of polish pad shape during pad dressing

Materials Science and Engineering B: Solid-State Materials for Advanced Technology

Volumn 68, Issue 2, 1999, Pages 91-98

  Zhou, Yi Yang ^a   Davis, Eugene C ^a  

^a Silicon Eng Technol Ctr Lab   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FRICTION; POLISHING;

PAD DRESSING; POLISH PAD;

SILICON WAFERS;

EID: 0033353871     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(99)00423-7     Document Type: Article

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