Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 899-905

  Yim, Myung Jin ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CALORIMETRY; CONDUCTIVE MATERIALS; EPOXY RESINS; FLIP CHIP DEVICES; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS;

ANISOTROPIC CONDUCTIVE ADHESIVES; COEFFICIENT OF THERMAL EXPANSION; DYNAMIC MECHANICAL ANALYZER; DYNAMIC SCANNING CALORIMETER; THERMOMECHANICAL ANALYZER;

ELECTRONICS PACKAGING;

EID: 0034482680     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)