Analysis of solder joint reliability in flip chip packages

International Journal of Microcircuits and Electronic Packaging

Volumn 25, Issue 1, 2005, Pages 147-159

  Zhang, Xiaowu ^a   Cui, C Q ^a   Chan, K C ^a   Wong, E H ^a   Iyer, Mahadevan K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Creep fatigue life prediction model; Flip Chip; Solder Joint Reliability; Underfill

Indexed keywords

CREEP FATIGUE; CREEP FATIGUE LIFE PREDICTION MODEL; DESIGN PARAMETERS; ELECTRONIC PACKAGING; FLIP CHIP; FLIP-CHIP PACKAGES; MAIN EFFECT; NON-LINEAR FINITE-ELEMENT ANALYSIS; PARAMETRIC STUDY; SOLDER FATIGUE; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SUBSTRATE THICKNESS; THERMAL FATIGUE-LIFE; UNDERFILL; UNDERFILL MATERIALS;

BRAZING; CHIP SCALE PACKAGES; CREEP; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; MATHEMATICAL MODELS; QUALITY ASSURANCE; RELIABILITY ANALYSIS; WELDING;

FATIGUE DAMAGE;

EID: 20344397755     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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