Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers

IEEE Transactions on Microwave Theory and Techniques

Volumn 51, Issue 12, 2003, Pages 2589-2596

  Heyen, Johann ^a   Von Kerssenbrock, Thomas ^b   Chernyakov, Alexander ^b   Heide, Patric ^b   Jacob, Arne F ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b EPCOS AG   (Germany)

Author keywords

Ceramics; Millimeter wave integrated circuits; Multichip modules; Packaging

Indexed keywords

ADHESIVES; CERAMIC MATERIALS; ELECTRONICS PACKAGING; ENCAPSULATION; MILLIMETER WAVES; TRANSCEIVERS;

ANISOTROPIC CONDUCTIVE PASTES; BALL GRID ARRAY; LOW TEMPERATURE CO FIRED CERAMIC; MILLIMETER WAVE INTEGRATED CIRCUITS; VERTICAL FEEDTHROUGH;

MULTICHIP MODULES;

EID: 0742321726     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2003.819210     Document Type: Article

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