The flip-chip bump interconnection for millimeter-wave GaAs MMIC

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 1, 1999, Pages 23-28

  Kusamitsu, Hideki ^b   Morishita, Yoshiaki ^b   Maruhashi, Kenichi ^a,b   Ito, Masaharu ^b   Ohata, Keiichi ^a,b  

^a IEEE

^b NEC CORPORATION   (Japan)

Author keywords

Electrical performance; Flip chip; MMIC; Reliability; RF packaging; Underfilling

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SEMICONDUCTING GALLIUM ARSENIDE;

BUMP INTERCONNECTIONS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033320082     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.755086     Document Type: Article

References (4)

1. R. Sturdivant, "Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips," in Proc. 1995 Int. Microwave Theory Tech. Symp. Dig., Orlando, FL, May 1995, pp. 1591-1594.
2. T. Krems, W. Haydl, H. Massler, and J. Rudiger, "Millimeter-wave performance of chip interconnections using wire bonding and flip chip," in Proc. 1996 Int. Microwave Theory Tech. Symp. Dig., San Francisco, CA, June 1996, pp. 247-250.
3. Y. Arai et al., "60 GHz flip-chip assembled MIC design considering chip-substrate effect," in Proc. 1997 Int. Microwave Theory Tech. Symp. Dig., Denver, CO, June 1997, pp. 447-450.
4. K. Tanaka et al., "A fine pitch lead-less-chip assembly technology with the build-up PCB," in Proc. 1996 ICEMCM Dig., Denver, CO, Apr. 1996, pp. 369-374.