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1
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0035686441
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LTCC as mcm substrate: Design of strip-line structures and flip-chip interconnects
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Phoenix, AZ, May
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F. J. Schmückle, A. Jentzsch, W. Heinrich, J. Butz, M. Spinnler, "LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects," IEEE MTT-S Int. Microwave Symp. Dig., Phoenix, AZ, May 2001, pp. 1903-1906.
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(2001)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 1903-1906
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Schmückle, F.J.1
Jentzsch, A.2
Heinrich, W.3
Butz, J.4
Spinnler, M.5
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2
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0035683101
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Vertical transitions in low temperature co-fired ceramics for lmds applications
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Phoenix, AZ, May
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A. Panther, C. Glaser, M. G. Stubbs, J. S. Wight, "Vertical Transitions in Low Temperature Co-Fired Ceramics for LMDS Applications," IEEE MTT-S Int. Microwave Symp. Dig., Phoenix, AZ, May 2001, pp. 1907-1910.
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(2001)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 1907-1910
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Panther, A.1
Glaser, C.2
Stubbs, M.G.3
Wight, J.S.4
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3
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0033694497
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A compact ltcc ku-band transmitter module with integrated filter for satellite communication application
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Boston, MA, May
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W. Simon, R. Kulke, A. Wien, M. Rittweger, I. Wolff, A. Girad, J.-P. Bertinet, "A Compact LTCC Ku-band Transmitter Module with Integrated Filter for Satellite Communication Application," IEEE MTT-S Int. Microwave Symp. Dig., Boston, MA, May 2000, pp. 1047-1050.
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(2000)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 1047-1050
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Simon, W.1
Kulke, R.2
Wien, A.3
Rittweger, M.4
Wolff, I.5
Girad, A.6
Bertinet, J.-P.7
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4
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84897543296
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Millimeter-wave 3d integration techniques using ltcc and related multilayer circuits
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Paris, September
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W. Menzel, and J. Kassner, "Millimeter-Wave 3D Integration Techniques using LTCC and related Multilayer Circuits," 30th EUMC, Paris, September 2000, pp. 33-36.
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(2000)
30th EUMC
, pp. 33-36
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Menzel, W.1
Kassner, J.2
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5
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0033354690
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Design of passive components for k-band communication modules in ltcc environment
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Chicago, Il., October
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W. Simon, R. Kulke, A. Wien, I. Wolff, S. Baker, R. Powell, M. Harrison, "Design of Passive Components for K-Band Communication Modules in LTCC Environment," 32nd Int. Sytnp. on Microelectronics, IMAPS, Chicago, Il., October 1999, pp. 183-188.
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(1999)
32nd Int. Sytnp. on Microelectronics, IMAPS
, pp. 183-188
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Simon, W.1
Kulke, R.2
Wien, A.3
Wolff, I.4
Baker, S.5
Powell, R.6
Harrison, M.7
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6
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0041591249
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Novel ltcc-/bga-modules for highly integrated millimeter-wave transceivers
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Philadelphia, Pennsylvania, June
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J. Heyen, T. v. Kerssenbrock, A. Chernyakov, P. Heide, A.F. Jacob, "Novel LTCC-/BGA-Modules for Highly Integrated Millimeter-Wave Transceivers," IEEE MTT-S Int. Microwave Symp. Dig., Philadelphia, Pennsylvania, June 2003, pp. 1041-1044.
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(2003)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 1041-1044
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Heyen, J.1
Kerssenbrock, T.V.2
Chernyakov, A.3
Heide, P.4
Jacob, A.F.5
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7
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0027848368
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Broad-band uniplanar hybrid-ring and branch line couplers
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December
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C.-H. Ho, L. Fan, K. Chang, "Broad-Band Uniplanar Hybrid-Ring and Branch Line Couplers," IEEE Trans. on Microwave Theory Techn., vol.41, no.12, pp. 2116-2125, December 1993.
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(1993)
IEEE Trans. on Microwave Theory Techn
, vol.41
, Issue.12
, pp. 2116-2125
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Ho, C.-H.1
Fan, L.2
Chang, K.3
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