Guidelines to select underfills for flip chip on board assemblies

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 86-92

  Okura, J H ^a   Reinikainen, T ^b   Dasgupta, A ^c   Caers, J F J M ^d  

^a NOKIA RESEARCH CENTER   (United States)

^b NOKIA RESEARCH CENTER   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Assembly; Computational modeling; Fatigue; Finite element methods; Flip chip; Guidelines; Predictive models; Thermal expansion; Thermal stresses; Thermomechanical processes

Indexed keywords

ASSEMBLY; COATINGS; CREEP; DURABILITY; ELASTIC MODULI; FATIGUE DAMAGE; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; JOINING; MANUFACTURE; STIFFNESS; STRESS ANALYSIS; STRESSES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS;

COMPUTATIONAL MODEL; FLIP CHIP; GUIDELINES; PREDICTIVE MODELS; THERMOMECHANICAL PROCESS;

FINITE ELEMENT METHOD;

EID: 18744375893     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860578     Document Type: Conference Paper

References (25)

1. ABAQUS Users Manual, Ver. 5.8, HKS Inc.
2. P3/PATRAN Users Manual, Ver 7.0, The McNeal-Schwendler Co
3. Doi H., Kawano K., and Yasukawa A., 1997, "Reliability of Underfill-Encapsulated Flip-Chip Packages", Application of Fracture Mechanics in Electronic Packaging. AMD-Vol. 222/EEP-Vol. 20 -ASME, pp. 7-14.
4. Doi K., Hirano N., Okada T., Hiruta Y., Sudo T., and Mukai M, 1996, "Prediciton of thermal fatigue for encapsulated flip chip interconnection", Microcircuits and Electronic Packaging. Vol 19, No. 3, pp.231-236.
5. Baggerman A. F. J., Jo F. J. M. Caers, Jan J. Wondergem and Antonius G. Wagemans, 1996, "Low-Cost Flip-Chip on Board", IEEE Transactions on Components, Packaging and Manufacturing Technology- Part B, Vol. 19, No. 4,pp. 736-746
6. Darbha K., Okura J. H., Dasgupta A., and Caers J. F. J. M., 1997, "Thermomechanical Durability Analysis of Flip Chip Solder Interconnects without Underfill", ASME Winter Annual Conference: 9th Symposium on Mechanics of Surface Mount Assemblies, November 1997, Dallas, Texas.
7. Dasgupta A., Oyan C., Barker D. and Pecht M., 1992, "Solder creep-fatigue analysis by an energy-partitioning approach", ASME Journal of Electronic Packaging, Vol. 114, pp.152-160
8. Le Gall A C., Qu J., and McDowell D., 1997, "Some mechanics issues related to the thermomechanical reliability of flip chip DCA with underfill encapsulation", ASME Symposium on Application of Fracture Mechanics in Electronic Packaging, AMD-Vol.222/EEP-Vol. 20, pp. 85-95
9. IPC SM 785, 1992, "Guidelines for Accelerated Testing of Surface Mount Solder Attachments", Proposed Standard of IPC Surface Mount Task Group, Institute for Interconnecting Packaging Electronic Circuits, Lincolnwood, IL.
10. Wang J., Qian Z. And Liu S., 1998, "Process Induced Stresses of a Flip Chip Packaging by Sequential Processing Modeling Technique", ASME Journal of Electronic Packaging, Vol. 120, pp 309-313.
11. Darbha K., Okura J. H., Dasgupta A., "Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1 - Without Underfill", Journal of Electronic Packaging, ASME, December, 1999, Vol. 121, pp. 231-236.
12. Darbha K., Okura J. H., Shetty S., Dasgupta A., Reinikainen T., Zhu J., and Caers J. F. J. M., "Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2 - With Underfill", Journal of Electronic Packaging, ASME, December, 1999, Vol. 121, pp. 237-241.
13. Skipor A. F., Harren S. V., and Botsis J., 1996, "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder," Journal of Engineering Materials and Technology, Vol. 118, p. 1-11.
14. Rothman T., 1995, "Physics-of-Failure Methodology for Accelerated Thermal Cycling of LCC Solder Joints", M.S. Thesis, University of Maryland
15. Okura J. H., Darbha K., Dasgupta A., "Effect of Underfill in Flip Chip on Board Assemblies", ASME Winter Annual Conference, 1998, Anahein, CA.
16. Gektin V., Bar-Cohen A., Ames J., 1997, "Coffin-Manson Fatigue Model of Underfilled Flip-Chips", IEEE Transactions on Components, Packaging and Manufacturing Technology- Part A, Vol. 20, No. 3, pp. 317-326.
17. Ramakrishna K., Johnson Z., "Effect of Material and Design Parameters on the Stresses Induced in a Direct-Chip-Attach Package During Underfill Cure", 1997, ASME Interpack'97, EEP-Vol. 19-2, Advances in Electronic Packaging.
18. Wong, T. E., 1998, Personal Communication.
19. Nagaraj B., Mahalingam M., 1998 "Package-to-Board Attach Reliability- Methodology and Case Study on OMPAC Package", ASME Journal of Electronic Packaging, Vol 120, pp 290-295.
20. Zhang X., Ricky Lee S-W., 1998, "Critical Issues in Computational Modeling and Fatigue Life Analysis for PBGA Joints", International Jopurnal of Microcircuits and Electronic Packaging, Vol 21, n 3, 253-261.
21. John H Lau., Ricky Lee S-W., 1999, "Chip Scale Package: Design, Materials Processes and Applications", McGraw Hill.
22. John H Lau., Yi-Hsin Pao., 1997, "Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies", McGraw Hill.
23. BPA Group Ltd., 1998, "Technology Update No.3", February 1998, p. 2.
24. R. D. Schueller, E. A. Bradley, and P. M. Harvey, 1999, "Meeting the Cost/Performance Requirements of Flex-Based Chip-Scale Packages", Chip Scale Review, January-February, 1999.
25. Dasgupta A., Clark D., Darbha K., Haswell P., Okura J., Ray C. and Shetty S., "Creep Constitutive Properties Literature Survey", CALCE internal report, 1999.