Reliability of underfill-encapsulated flip-chip packages

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 7-14

  Doi, Hroaki ^a   Kawano, Kenya ^a   Yasukawa, Akio ^a   Sato, Toshihiko ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DELAMINATION; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; FRACTURE; INTERFACES (MATERIALS); RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; STRESSES; THERMAL CYCLING;

HEAT SPREADER; PLASTIC STRAIN; UNDERFILL;

FRACTURE MECHANICS;

EID: 0031369725     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)

1. Clementi, J., et al., 1993, "Flip-Chip Encapsulation On Ceramic Substrates," Proceedings of the 43rd Electronic Component and Technology Conference, pp. 175-181.
2. Doi, K., et al., 1995. "Prediction of Thermal Fatigu Life for Encapsulated Flip Chip Interconnection," Proceedings of ISHM, pp. 247-252.
3. Nakano, F., Soga, T., and Amagi, S ,. 1987, "Resininsertion Effect on Thermal Cycling Resistivity of Flip Chip Mounted LSI Devices," Proceedings of ISHM, pp. 536-541.
4. Satoh, R., et al., 1991, "Thermal Fatigue Life of Pb-Sn Alloy Interconnections," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, pp. 224-230.
5. Suryanarayana, D., et al., 1991. "Enhancement of Flip-Chip Fatigue Life by Encapsulation," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, pp. 218-223.