Thermomechanical durability analysis of flip chip solder interconnects without underfill

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1997, Pages

  Darbha, K ^a   Okura, J H ^a   Dasgupta, A ^a   Caers, Jo F J M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DURABILITY; ELASTOPLASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; STRENGTH OF MATERIALS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THERMAL STRESS; VISCOPLASTICITY;

MULTI DOMAIN RAYLEIGH RITZ (MDRR) METHOD;

SOLDERED JOINTS;

EID: 0031331633     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)