Package-to-board attach reliability-methodology and case study on ompac package

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 290-295

  Nagaraj, B ^a   Mahalingam, M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; PARAMETER ESTIMATION; PERFORMANCE; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

SOLDER PADS;

ELECTRONICS PACKAGING;

EID: 0032166505     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792635     Document Type: Article

References (5)

1. Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,”Proc. 42nd ECTC, pp. 538-551.
2. ABAQUS 4.8 User's Manual, 1991, HKS, pp. 6.6.-7.1.
3. Norris, K. C., and Landzberg, A. H., 1969, “Reliability of Controlled Collapse Interconnections,”IBM Journal of Research and Development, May pp. 266-271.
4. Sarihan, V., 1993, “Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling,” ASME Journal of Electronic Packaging, Vol. 115, No. 1, pp. 16-21.
5. Neijzen, J., internal technical report, Phillips.