Effect of material and design parameters on the stresses induced in a direct-chip-attach package during underfill cure

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1639-1646

  Ramakrishna, K ^a   Johnson, Zane ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041643620     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (22)

1. Anon, ftp://cmpc1.phys.soton.ac.uk/pub, version 3.5 patchlevel beta 273, (c) 1986-1995 Thomas Williams and Colin Kelly.
2. Becher, C., Brooks, R., Kirby, T., Wasko, K., Moore, K., Raleigh, C., and Stafford, J. W., 1993, "Direct Chip Attach (DCA) The Introduction of a New Packaging Concept for Portable Electronics," Proc. of the Technical Conf., Intl. Electronics Packaging Conf., San Diego, CA (September 12-15, 1993), pp. 519-527.
3. Carden, T., Clementi, J., and Engle, S., 1994, "Epoxy Encapsulation on Ceramic Quad Flat Packs," Proc. of the 44th Electronic Components & Technology Conf., IEEE CHMT Soc., Washington, D.C. (May 1-4, 1994), pp. 585-589.
4. Clementi, J., McCreary, J., Niu, T. M., Palomaki, J., Varcoe, J., and Hill, G., 1993, "Flip-Chip Encapsulation on Ceramic Substrates," Proc. of the 43rd Electronic Components & Technology Conf., IEEE CHMT Soc., Orlando, FL (June 1-4, 1993), pp. 175-181.
5. Darveaux, R., Norton, L., and Carney, F., (1995), "Temperature Dependent Mechanical Behavior of Plastic Packaging Materials,", Proc. Of the 45th Electronic Components & Technology Conf., IEEE CHMT Soc., Las Vegas, NV (May 21-24, 1995), pp. 1054-1058.
6. Doot, R. K., 1996, "Motorola's First DCA Product: The Gold Line Pen Pager," Proc. Of the 43rd Electronic Components & Technology Conf., IEEE CHMT Soc., Orlando, FL (May 28-31, 1996), pp. 535-539.
7. Gektin, V., Bar-Cohen, A., and Witzman, S., 1996, "Thermo-Structural Behavior of Underfilled Flip-Chips," Proc. Of the 46th Electronic Components & Technology Conf., IEEE CHMT Soc., Orlando, FL. (May 28-31, 1996), pp. 440-447.
8. Hawkins, G., Berg, H., Mahalingam, M., Lewis, G., and Lofgran, L., 1987, "Measurement of Silicon Strength as Affected by Wafer Back Processing," Proc. of the 25th Annual Reliability Physics Symp., organized by IEEE/IRPS, 1987, pp. 216-223.
9. Hu, K. X., Yeh, C-P., Doot, B., Skipor, A. F., and Wyatt, K. W., 1995, "Die Cracking in Flip-Chip-on Board Assembly," Proc. of the 45th Electronic Components & Technology Conf., IEEE CHMT Soc., Las Vegas, NV. (May 21-24, 1995), pp. 293-299.
10. Le Gall, C. A., 1996, "Thermo-mechanical Stress Analysis of Flip-Chip Packages," MS Thesis, Department of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA.
11. Le Gall, C. A., Qu, J., and McDowell, D. L., 1996, "Delamination Cracking in Encapsulated Flip Chips," Proc. of the 46th Electronic Components & Technology Conf., IEEE CHMT Soc., Orlando, FL. (May 28-31, 1996), pp. 440-447.
12. Machuga, S. C., Lindsey, S. E., Moore, K. D., and Skipor, A. P., "Encapsulation of Flip Chip Structures," IEEE CHMT Intl. Manufacturing Technology Symp., Baltimore, MD, pp. 53-58.
13. O'Malley, G. O., Giesler, J., and Machuga, S., 1994, "The Importance of Material Selection for Flip Chip on Board Assemblies," IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, v. 17, no. 3, pp. 248-255
14. Powell, D. O., and Trivedi, A. K., 1993, "Flip-Chip on FR4 Integrated Circuit Packaging," Proc. of the 43rd Electronic Components & Technology Conf., IEEE CHMT Soc., Orlando, FL (June 1-4, 1993), pp. 182-186.
15. Ramakrishna, K., Chen, W. T., Thiel, G. H., Steinwall, J. E., and Niu, T. M., 1994, "Plated Through Holes in Thick Wiring Boards: Interaction Between Design, Materials, and Assembly Processes," in "Mechanics and Materials for Electronic Packaging: Vol. 1: Design and Process Issues in Electronic Packaging," Chen, W.T., Nguyen, L. T., and Winterbottom, W. L., (editors), AMD-Vol. 195, pp. 1-10, 1994 ASME Intl. Mech. Engg. Congress and Conf., Chicago, IL (November 6-11, 1994).
16. Sarihan, V., 1993, "Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling," Trans. ASME, J. of Electronic Packaging, v. 115, no. 1, pp. 16-21.
17. Suryanarayana, D., Hsiao, R., Gall, T. P., and McCreary, J. M., 1991, "Enhancement of Flip-Chip Fatigue Life by Encapsulation" IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. CHMT-14, no. 1, pp. 218-223.
18. Tsukada, Y., Mashimoto, Y., Nisho, T., and Mii, N., "Reliability and Stress Analysis of Encapsulated Flip Chip Joint on Epoxy Base Printed Circuit Board," in "Advances in Electronic Packaging 1992 " Chen, W. T., and Abe, H., (editors), Proc. of the 1992 Joint ASME/JSME Conf. on Electronic Packaging, Milpitas, CA (April 9-12, 1992), ASME EEP-Vol. 2, pp. 827-835.
19. Wu, T. Y., Guo, Y., and Chen, W. T., 1993, "Thermal-Mechanical Strain characterization of Printed Wiring Boards," IBM J. of Research and Development, vol. 37, no. 5, 621-634,1993.
20. Wu, T. Y., and Woychik, C. G., 1991, "Void Assisted Cracking in Copper Foil at High Temperatures," in Manufacturing Processes and Materials Challenges in Microelectronic Packaging, Chen, W. T. Engel, P., and Jahsman, W. E. (editors), Am. Soc. of Mech. Engineers, NY, AMD-Vol. 131/EEP-Vol. 1, pp. 11-15.
21. Yeh, C-P., Zhou, W. X., Skipor, A. F., and Wyatt, K., 1995, "Parametric Finite Element Analysis of Flip Chip on Board Reliability," Proc. Of the Technical Conf., Intl. Electronics Packaging Conf., San Diego, CA (September 12-15, 1993), pp. 297-306.
22. Zheng, W. C., Harren, S. V., and Skipor, A. F., 1994, "Thermo-mechanical Analysis of Flip-Chip-on-Board Electronic Packaging Assembly," ASME Paper No. 94-WA/EEP-14, Intl. Mech. Engg. Congress & Exhibition of the Winter Annual Meeting, Chicago, IL (November 6-11, 1994), pp. 1-5.