Effect of viscosity of liquid resin on resin self-alignment capability

Materials Science Forum

Volumn 439, Issue , 2003, Pages 12-17

  Kim, Jong Min ^a   Shin, Young Eui ^b   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (South Korea)

Author keywords

Lead free; Low process temperature; Micro opto electro mechanical systems (MOEMS); Microelectromechanical systems (MEMS); Optoelectronic multichip modules (OE MCMs); Self alignment

Indexed keywords

MICROELECTROMECHANICAL DEVICES; SOLDERING ALLOYS; SURFACE TENSION; THERMAL EFFECTS; THERMAL STRESS; VISCOSITY; WETTING;

LIQUID RESIN; RESIN SELF ALIGNMENT CAPABILITY;

RESINS;

EID: 0344981421     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.439.12     Document Type: Conference Paper

References (13)

1. M. Abtew and G. Selvaduray: Mater. Sci. Eng. R: Reports, Vol. 27, No. 5-6 (2000), p. 95.
2. J. Liu: Conductive Adhesives for Electronics Packaging (Electrochmical Publications, England 1999).
3. K. W. Oh, C.H. Ahn and K.P. Roenker: IEEE Quantum Electronics, Vol. 5, No. 1 (1999), p. 119.
4. D.W. Prather, S. Venkataraman, M. Lecompte, F. Kiamilev and G.J. Simonis: IEEE Photo. Tech. Letters, Vol. 13, No. 10 (2001), p. 1112.
5. J.C. Jagt, P.J.M. Beris and G.F.C.M. Lijten: IEEE Trans. Comp. Packag. Manufact. Technol. Part-B, Vol. 18, No. 2 (1995), p. 292.
6. J. Liu, Z. Lai, H. Kristiansen and K. Khoo: 3rd Int. Con. Adhe. Join. Coat. Technol. Elec. Manufat. (1998), p. 1.
7. P.G. Harris: Soldering & Surface Mount Technology, No. 20 (1995), p. 19.
8. G. Sarkar, S. Mridha, T.T. Chong, W.Y. Tuck and S.C. Kwan: J. Mat. Proce. Tech., (1999), p. 484.
9. K.S. Moon, J. Wu and C.P. Wong: 2001 Int. Sym. Adv. Pack. Mater., (2001), p. 341.
10. L. F. Miller: IBM J. Res. Develop., Vol. 13 (1969), p. 239.
11. J.M. Kim, K. Fujimoto and S. Nakata: 7th Int. Sym. JWS, (2001), p. 1271.
12. K. Fujimoto, J.M. Kim and S. Nakata: IEICE Trans. Elec., Vol. E84-C, No. 12 (2001), p. 1967.
13. J.M. Kim, K. Yasuda, Y.E. Shin and K. Fujimoto: IEICE Trans. Elec., Vol. E85-C, No. 7 (2002), p. 1491.