Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

Physica Scripta T

Volumn T114, Issue , 2004, Pages 223-226

  Tuomikoski, Santeri ^a   Franssila, Sami ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CROSSLINKING; ELECTRIC INSULATING MATERIALS; EPOXY RESINS; MICROFLUIDICS; PHOTORESISTS;

ADHESIVE BONDING METHOD; MEMS STRUCTURES; SURFACE ELECTROCHEMISTRY; WAFER-LEVEL BONDING;

MEMS;

EID: 17644373522     PISSN: 02811847     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1088/0031-8949/2004/T114/056     Document Type: Conference Paper

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