Possibilities of extension of 3D shapes by bulk micromachining of different Si (h k l) substrates

Journal of Micromechanics and Microengineering

Volumn 15, Issue 3, 2005, Pages 485-493

  Zubel, I ^a   Kramkowska, M ^a  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRYSTAL ORIENTATION; ETCHING; MASKS; SEISMOLOGY; SILICON WAFERS; THREE DIMENSIONAL;

ETCH RATE ANISOTROPY; ETCHED STRUCTURES; SEISMIC MASS SYSTEM; STEREOGRAPHIC PROJECTION;

MICROMACHINING;

EID: 15544384859     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/3/008     Document Type: Article

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