Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures

Journal of Micromechanics and Microengineering

Volumn 15, Issue 3, 2005, Pages 580-585

  Chang, Chienliu ^a   Wang, Yeong Feng ^a   Kanamori, Yoshiaki ^b   Shih, Ji Jheng ^a   Kawai, Yusuke ^b   Lee, Chih Kung ^a   Wu, Kuang Chong ^a   Esashi, Masayoshi ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; DATABASE SYSTEMS; FABRICATION; INDUCTIVELY COUPLED PLASMA; MASKS; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; REACTIVE ION ETCHING; SILICA; SURFACE ROUGHNESS; THIN FILMS;

ANTIREFLECTION STRUCTURES; BOSCH PROCESS; DEEP REACTIVE ION ETCHING (DRIE) SYSTEM; SUBMICROMETER TRENCHES;

TRENCHING;

EID: 15544378397     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/3/020     Document Type: Article

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