Fast atom beam etching of glass materials with contact and non-contact masks

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 12 SUPPL. B, 1997, Pages 7655-7659

  Toma, Yasushi ^a   Hatakeyama, Masahiro ^a   Ichiki, Katsunori ^a   Huang, Hailing ^a   Yamauchi, Kazuo ^a   Watanabe, Kenji ^a   Kato, Takao ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

Contact mask; Etching; FAB; Fast atom beam; Micro particle mask; Multicomponent glass; Nano scale ultrafine etching; Non contact mask; Silica glass

Indexed keywords

ATOMIC BEAMS; ETCHING; FUSED SILICA; MASKS; NANOTECHNOLOGY; SUBSTRATES;

FAST ATOM BEAM (FAB) ETCHING; MICRO PARTICLE MASKS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031382389     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.7655     Document Type: Article

References (4)

1. M. Hatakeyama, K. Ichiki, T. Kobata, M. Nakao and Y. Hatamura: IEICE Trans. Electron. E78-C(2) (1995) 174.
2. M. Hatakeyama, S. Tanaka, K. Ichiki, Y. Toma, M. Nakao and Y. Hatamura: Microsys. Technol. 3 (1997) 112.
3. S. Ronggui and G. C. Righini: J. Vac. Sci. Technol. A 9 (1991) 2709.
4. Stainbruchel, H. W. Lehmann and K. Frick: J. Electrochem. Soc.: Solid-State Sci. Technol. (1985) 180.