Design-based thermal simulation methodology for ball grid array packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 82-87

  Johnson, Zane ^a   Eyman, Mike ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HEAT CONDUCTION; MATHEMATICAL MODELS; SOLDERED JOINTS; THERMAL CONDUCTIVITY;

BALL GRID ARRAY; CONTROLLED COLLAPSE CHIP CONNECTION; CONTROLLED COLLAPSE CHIP CONNECTION CARRIER; SOLDER BALL ARRAY; THERMAL SIMULATION;

ELECTRONICS PACKAGING;

EID: 0031626171     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)