Development of solder replacement isotropic conductive adhesives

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 304-312

  Wong, C P ^a   Lu, D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS;

CONDUCTIVE ADHESIVE; ELECTRICAL CONDUCTIVITY; ELEVATED TEMPERATURE; IMPACT PERFORMANCE; ISOTROPIC CONDUCTIVE ADHESIVES; SOLDER REPLACEMENT; SOLDERING TECHNOLOGY;

SOLDERING;

EID: 14844291127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904171     Document Type: Conference Paper

References (57)

1. H.H. Manko, Solders and Soldering. Materials. Design. Production, and Analysis for Reliable Bonding. Me. Graw-Hill, 2nd Edition (1979), pp. 1-123.
2. R.J.K. Wassink, Soldering in Electronics. Electrochemical Publications (1984).
3. F.N. Sinnadurai, Handbook of Microelectronics Packaging and Interconnection Technologies. Electrochemical Publications (1985).
4. L.P. Lambert, Soldering for Electronic Assemblies. New York (1987).
5. Bill Trumble, "Get the Lead Out!," IEEE Spectrum, May 1998, p. 55-60.
6. B.T. Alpert and A.J. Schoenberg, "Conductive Adhesives as a Soldering Alternative," Electronic Packaging & Production, November 1991, p. 130-132.
7. J. C. Jagt, "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art," IEEE Transactions on Components, Packaging, and Manufacturing Technology, part A, Vol. 21, No. 2, 1998, p. 215-225.
8. A.O. Ogunjimi, O. Boyle, D.C. Whalley, and D.J. Williams, "A Review of the Impact of Conductive Adhesive Technology on Interconnection," Journal of Electronics Manufacturing, Vol. 2, 1992, pp. 109-118.
9. P.G. Harris, "Conductive Adhesives: A Critical Review of Progress to Date," Soldering & Surface Mount Technology, No. 20, May 1995, pp. 19-21.
10. K. Gilleo, "Assembly with Conductive Adhesives," Soldering & Surface Mount Technology, No. 19, February 1995, pp. 12-17.
11. J. Liu, Z. Lai, H. Kristiansen, and C. Khoo, "Overview of Conductive Adhesive Joining Technology in Electronics Packaging Applications," Proceedings of the 3rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton, New York, September 1998, pp. 1-17.
12. S. Corbett and M. J. Dominano, "Processing with Polymer Solders," Surface Mount Technology, June 1997, p. 48-52.
13. J. Bolger and S. Morano, "Conductive Adhesives: How and Where They Work," Adhesives age, June 1984, pp. 17-20.
14. J. Greaves, "Evaluation of Solder Alternatives for Surface Mount Technology," Proceedings of Nepcon West Technical Program, 1993, pp. 1479-1488.
15. M.A. Gaynes, R.H. Lewis, R.F. Saraf and J.M. Roldan, "Evaluation of Contact Resistance for Isotropic Conductive Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 18, No. 2, 1995, pp. 299-304.
16. G. Nguyen, J. Williams, F. Gibson, and T. Winster, "Electrical Reliability of Conductive Adhesives for Surface Mount Applications," Proceedings of International Electronic Packaging Conference, 1993, pp. 479-486.
17. G. Nguyen, J. Williams, and F. Gibson, "Conductive Adhesives: Reliable and Economical Alternatives to Solder Paste for Electrical Applications," ISHM Proceedings, 1992, pp. 510-517.
18. J. C. Jagt, P.J.M. Beric and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering'," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B. Vol. 18, No. 2 (1995), pp. 292-298.
19. M. Zwolinski, J. Hickman, H. Rubon, and Y. Zaks, "Electrically Conductive Adhesives for Surface Mount Solder Replacement," Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 3-5,1996, pp. 333-340.
20. H. Botter, "Factors That Influence the Electrical Contact Resistance of Isotropic Conductive Adhesive Joints During Climate Chamer Testing," Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 3-5, 1996, pp.30-37.
21. CP. Wong, D. Lu, S. Vona, and Q.K. Tong, "A Fundamental Study of Electrically Conductive Adhesives," Proceedings of the 1st IEEE International Symposium on Polymeric Electronics Packaging, Norrkoping, Sweden, 1997, pp. 80-85.
22. L. Smith-Vargo, "Adhesives That Posses a Science All Their Own," Electronic Packaging & Production, August 1986, pp. 48-49.
23. E.M. Jost and K. McNeilly, "Silver Flake Production and Optimization for Use in Conductive Polymers," Proceedings of ISHM, 1987, pp. 548-553.
24. S.M. Pandiri, "The Behavior of Silver Flakes in Conductive Epoxy Adhesives," Adhesives Age, Oct. 1987, pp. 31-35.
25. D. Lu, Q.K. Tong, and CP. Wong, "A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 22, No. 3, 1999, pp. 365-371.
26. D. Lu, Q. Tong, and CP. Wong, "A Fundamental Study on Silver Flakes for Conductive Adhesives," 1998 International Symposium on Advanced Packaging Materials, Braselton, G A, 1998, pp. 256-260.
27. A.J. Lovinger, "Development of Electrical Conduction in Silver-filled Epoxy Adhesives," Journal of Adhesion, Vol. 10, 1979, pp. 1-15.
28. D. Lu, Q.K. Tong, and CP. Wong, "Conductivity Mechanisms of Isotropic Conductive Adhesives (ICAs)," Proceedings of 4'1' International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, March 17-19, 1999, pp. 2-10.
29. J. Morris and C. Cook, "Recent Results of ICA Testing," 2nd IEEE International Symposium on Polymeric Electronic Packaging, Gothenburg, Sweden, Oct. 1999, pp. 15-26.
30. C. Gallagher, G. Matijasevic, and J.F. Maguire, "Transient Liquid Phase Sintering Conductive Adhesives as Solder Replacement," Proceedings of the 47th Electronic Components and Technology Conference, 1997, pp. 554-560.
31. J.W. Roman and TW. Eagar, "Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding," Proceedings of ISHM, 1992, pp.52-57.
32. C. Gallagher, G. Matijasevic, and A. Capote, "Transient Liquid Phase Sintering Conductive Adhesives," US Patent 5863622, August 1998.
33. D. Lu and CP. Wong, "Development of Conductive Adhesives Filler with Low-melting-point Alloy Fillers," International Symposium on Advanced Packaging Materials, Braselton, GA, March 6, 2000, pp.7-13.
34. K. Gilleo, "Evaluating Polymer Solders for Lead Free Assembly, Parti," Circuits Assembly, 1994, pp. 50-51.
35. K. Gilleo, "Evaluating Polymer Solders for Lead Free Assembly, Partii," Circuits Assembly, 1994, pp. 51-53.
36. D. Lu, Q.K. Tong, and CP. Wong, "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," Proceedings of the 49th Electronic Components and Technology Conference, 1999, pp. 342-346.
37. Q.K. Tong, G. Fredrickson, R. Kuder, and D. Lu, "Conductive Adhesives with Superior-Impact Resistance and Stable Contact Resistance," Proceedings of the 49 th Electronic Components and Technology Conference, 1999, pp. 347-352.
38. D. Lu and CP. Wong, "Novel Conductive Adhesives for Surface Mount Applications," Journal of Applied Polymer Science, Vol. 74, 1999, pp. 399-406.
39. D. Lu and CP. Wong, "Novel Conductive Adhesives with Stable Contact Resistance," Proceedings of 4th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, March 17-19, 1999, pp. 288-294.
40. D. Lu and CP. Wong, "Development of Solder Replacement Conductive Adhesives with Stable Resistance and Superior Impact Performance," also in this proceedings.
41. Q.K. Tong, A. Xiao, and D. Lu, "Conductive and Resistive Materials with Electrical Stability for Use in Electronics Devices", US Patent, filed in March 1999.
42. H. Leidheiser, Jr., "Mechanism of Corrosion Inhibition with Special Attention to Inhibitors in Organic Coatings," Journal of Coatings Technology, Vol. 53, No. 678, 1981, pp.29-39.
43. G. Trabanelli and V. Carassiti, "Mechanism and Phenomenology of Organic Inhibitors," Advanced Corrosion Science and Technology., ed. M.G. Fontana and R.W. Staehle, Vol. 1, Plenum Press, New York, NY, 1970, pp. 147-229.
44. G. Trabanelli, "Corrosion Inhibitors," Corrosion Mechanisms, ed. F. Mansfeld, Marcel Dekker, Inc., New York, NY, 1987, pp. 119-164.
45. O. L. Riggs, Jr., "Theoretical Aspects of Corrosion Inhibitors and Inhibition," C.C. Nathan Ed., NACE, 1973, pp.2-27.
46. P.A. Reardon, "New Oxygen Scavengers and Their Chemistry under Hydrothermal Conditions," Corrosion'86, Paper no. 175, NACE, Houston, TX, 1986.
47. M.G. Noack, "Oxygen Scavengers," Corrosion'89, Paper no. 436, NACE, Houston, TX, 1989.
48. P.A. Reardon and W.E. Bernahl, "New Insight into Oxygen Corrosion Control," Corrosion'87, Paper no. 438, NACE, Houston, TX, 1987.
49. S. Romaine, "Effectiveness of a New Volatile Oxygen Scavenger," Proceedings of the American Power Conference, Chicago, IL, April 14-16, 1986, pp. 1066-1073.
50. D. Durand, D. Vieau, A.L. Chu, and T.S. Weiu, "Electrically Conductive Cement Containing Agglomerates, Flake and Powder Metal Fillers," US Patent 5180523, Nov. 1989.
51. S. Kotthaus, R. Haug, H. Schafer, O.D. Hennemann, Proceedings of Ist IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, Norrkoping, Sweden, pp. 64-69.
52. S. Macathy, Proceedings of Surface Mount International, San Jose, August 27-31, 1995, pp. 562-567.
53. S.A. Vona and Q.K. Tong, "Surface Mount Conductive Adhesives with Superior Impact Resistance," Proceedings of 4th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, March 14-16, 1998, pp. 261-267.
54. J. Liu and B. Weman, "Modification of Processes and Design Rules to Achieve High Reliable Conductive Adhesive Joints for Surface Mount Technology," Proceedings of the 2nd International Symposium on Electronics Packaging Technology, Dec. 9-12, 1996, pp. 313-319.
55. D. Lu and CP. Wong, "High Performance Electrically Conductive Adhesives," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 4, 1999, pp.324-330.
56. D. Lu and CP. Wong, "Electrically Conductive Adhesives Having Superior Impact Performance," US Patent, Filed in November 1999.
57. Y. Rao, D.Lu and CP. Wong, "Study on Impact Performance of Conductive Adhesives," submitted to Journal of Electronics Manufacturing, July 2000.