Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 2-10

  Lu, Daoqiang ^a   Tong, Q K ^b   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

Author keywords

conductivity establishment; isotropic conductive adhesives; mechanism; shrinkage

Indexed keywords

ADHESIVES; CURING; FILLERS; INTERFACES (MATERIALS); MECHANISMS; PACKAGING MATERIALS; RESINS; SHRINKAGE; SILVER;

ADHESIVE SHRINKAGE; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; CONDUCTIVITY MECHANISMS; ELECTRICAL CONDUCTIVITY; EXTERNAL PRESSURES; ISOTROPIC CONDUCTIVE ADHESIVES; RESIN CURE SHRINKAGE;

ADHESIVE PASTES;

EID: 84994167949     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757278     Document Type: Conference Paper

References (13)

1. M. Zwolinski, "Electrically Conductive Adhesives for Surface Mount Solder Replacement, " IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 19, no. 4, p. 241, 1996.
2. L. Li, C. Lizzul, K. Hansoo, I. Sacolik, and J.E. Morris, "Electrical, Structural and Processing Properties of Electrically Conductive Adhesives, " IEEE trans. Comp., Hybrids, Manufact. Technol., vol. 16, no. 8, p. 843, 1993.
3. G.P. Nguyen, J.R. Willieams, F.W. Gibson, and T. Winster, "Electrical Reliability of Conductive Adhesives for Surface Mount Applications, " Proceedings of the Int. Soc. For Hyb. Microelectronics, p. 50, 1993.
4. Henrik L. Hvims and E. Centralen, "Solder Replacement, " Proceedings of Int 'I Electronics Manufacturing Technoloa Symposium, p. 128, 1993.
5. J.C. Jagt, P.J.M. Beris and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?, " IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 18, no. 2, p. 2921, 1995.
6. B.T. Alpet and A.J. Schoenberg, "Conductive Adhesives as a Soldering Alternative, " Electronic Packaging and Production, p. 131, 1991.
7. A. J. Lovinger, "Development of Electrical Conduction in Silver-filled Epoxy Adhesives, " J. Adhesion, vol. 10, p. 1, 1979.
8. C.P. Wong, D. Lu, L. Meyer, S. Vona, and Q. Tong, "Fundamental Study of Electrically Conductive Adhesives, " Proceeding of the 1st. IEEE International Polymeric Electronics Packaging, p. 80, 1997.
9. G.R. Ruschau, S. Yoshikawa, and R.E. Newnham, "Resistivities of Conductive Composites, " J. Appl. Phys., vol. 72 (3), p. 953, 1992.
10. E. Sancaktar and Y. Wei, "The Effect of Pressure on the Initial Establishment of Conductive Paths in Electronically Conductive Adhesives, " Journal of Adhesion, Science and Technology, Vol. 10, no. 11, p. 1221, 1996.
11. D. Lu, C.P. Wong, and Q. Tong, "A Fundamental Study on Silver Flakes for Conductive Adhesives, " Proceedings of the 4th International Symposium on Advanced Packaging Materials, p. 256, 1997.
12. E.M. Jost and Kirk MaNeilly, "Silver Flake Production and Optimization for Use in Conductive Polymers, " ISHM'87 Proceedings, p. 548 (1987).
13. D. Lu, Q. Tong, and C.P. Wong, "A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives, " accepted to be published in IEEE Transactions on Components, Packaging, and Manufacturing Technology, part A.