Processing with polymer solders

Surface mount technology

Volumn , Issue Suppl, 1997, Pages

  Corbett, Steve ^a   Domiano, Martin J ^a  

^a Poly Flex Circuits   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE PLASTICS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; POLYMERS;

POLYMER SOLDERS;

SOLDERING;

EID: 0031269443     PISSN: 08933588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)