The grain size and microstructure of jet-electroplated damascene copper films

Journal of the Electrochemical Society

Volumn 152, Issue 2, 2005, Pages

  Tzanavaras, Andrew ^a   Young, Gregory ^a   Gleixner, Stacy ^a  

^a SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACID COPPER SULFATE; COPPER FILMS; HIGH-TEMPERATURE ANNEALING; INTERCONNECT METALLIZATION;

COMPOSITION; COPPER; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE EFFECTS; RECRYSTALLIZATION (METALLURGY); TWINNING; ULSI CIRCUITS;

METALLIC FILMS;

EID: 14744270504     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1846712     Document Type: Article

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