Copper electroplating for damascene ULSI interconnects

Materials Research Society Symposium - Proceedings

Volumn 514, Issue , 1998, Pages 275-280

  Dubin, V M ^a   Lopatin, S ^a   Chen, S ^a   Cheung, R ^a   Ryu, C ^a   Wong, S S ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHEMICAL POLISHING; COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTROLYTES; ELECTROPLATING; IONS; MICROSTRUCTURE; TANTALUM;

CHEMICAL MECHANICAL POLISHING; COPPER ELECTROPLATING; ELECHEMICAL DEPOSITION;

ULSI CIRCUITS;

EID: 0032289081     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-514-275     Document Type: Conference Paper

References (2)