Intrinsic stress development and microstructure evolution of Au/Cr/Si multilayer thin films subject to annealing

Scripta Materialia

Volumn 52, Issue 9, 2005, Pages 873-879

  Miller, David C ^a   Herrmann, Cari F ^a,b   Maier, Hans J ^c   George, Steve M ^b   Stoldt, Conrad R ^a   Gall, Ken ^a  

^a University of Colorado   (United States)

^b UNIVERSITY OF COLORADO   (United States)

^c UNIVERSITY OF PADERBORN   (Germany)

Author keywords

Material stability; MEMS; Reliability; Thin metal films

Indexed keywords

ANNEALING; CHROMIUM; GOLD; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; MULTILAYERS; RELIABILITY; SILICON; STRESS ANALYSIS;

MATERIAL STABILITY; MEMS; MICROSTRUCTURE EVOLUTION; MULTILAYER THIN FILMS; STRESS DEVELOPMENT; THIN METAL FILMS;

THIN FILMS;

EID: 13644251778     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.01.004     Document Type: Article

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