Direct imprint of sub-10 nm features into metal using diamond and SiC stamps

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 3257-3259

  Lister, K A ^a,c   Thoms, S ^a   Macintyre, D S ^a   Wilkinson, C D W ^a   Weaver, J M R ^a   Casey, B G ^b  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b Kelvin Nanotechnology Ltd   (United Kingdom)

^c NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; DIAMONDS; ELECTRON BEAM LITHOGRAPHY; MASKS; NICKEL; PLASMA ETCHING; REACTIVE ION ETCHING; SILICON CARBIDE;

EMBOSSING; HYDROGEN SILSESQUIOXANE (HSQ); PATTERN TRANSFER; ULTRASONIC AGITATION;

NANOSTRUCTURED MATERIALS;

EID: 13244288127     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1825010     Document Type: Conference Paper

References (16)

1. D. J. Resnick, W. J. Dauksher, D. Mancini, K. J. Nordquist, T. C. Bailey, S. Johnson, N. Stacey, J. G. Ekerdt, C. G. Willson, S. V. Sreenivasan, and N. Schumaker, J. Vac. Sci. Technol. B 21, 2624 (2003).
2. B. G. Casey, D. R. S. Cumming, I. I. Khandaker, A. S. G. Curtis, and C. D. W. Wilkinson, Microelectron. Eng. 46, 125 (1999).
3. N. Gadegaard, S. Thoms, D. S. Macintyre, K. Mcghee, J. Gallagher, B. Casey, and C. D. W. Wilkinson, Microelectron. Eng. 67-68, 162 (2003).
4. C. D. W. Wilkinson, M. Riehle, M. Wood, J. Gallagher, and A. S. G. Curtis, Mater. Sci. Eng., C 19, 263 (2002).
5. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Appl. Phys. Lett. 67, 3114 (1995).
6. Y. Chen, D. S. Macintyre, and S. Thoms, Microelectron. Eng. 67-68, 245 (2003).
7. G. Messina, A. Paoletti, S. Santangelo, and A. Tucciarone, Microelectron. Eng. 34, 147 (1997).
8. H. Namatsu, T. Yamaguchi, M. Nagase, K. Yamasaki, and K. Kurihara, Microelectron. Eng. 41/42, 331 (1998).
9. B. E. Maile, W. Henschel, H. Kurz, B. Rienks, R. Polman, and P. Kaars, Jpn. J. Appl. Phys., Part 1 39, 6836 (2000).
10. K. A. Lister, B. G. Casey, P. S. Dobson, S. Thorns, D. S. Macintyre, C. D. W. Wilkinson, and J. M. R. Weaver, Microelectron. Eng. 73-74, 319 (2004).
11. P. H. Yin, V. Saxena, and A. J. Stenckl, Phys. Status Solidi B 202, 605 (1997).
12. S. W. Pang, T. Tamamura, M. Nakao, A. Ozawa, and H. Masuda, J. Vac. Sci. Technol. B 16, 1145 (1998).
13. Diamonex Incorported, 7331 William Ave, Allentown, PA 18106.
14. Dow Corning, P.O. Box 994, Midland, MI 48686-0994.
15. Cree Inc. 4600 Silicon Drive, Durham, NC 27703.
16. A. S. G. Curtis, N. Gadegaard, M. J. Dalby, M. O. Riehle, C. D. W. Wilkinson, and G. Aitchison, IEEE Trans. Nanobiosci. 3, 61 (2004).