![]() |
Volumn 22, Issue 6, 2004, Pages 3210-3213
|
Plasma doping technology for fabrication of nanoscale metal-oxide-semiconductor devices
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ANNEALING;
CHEMICAL ACTIVATION;
CRYSTAL IMPURITIES;
DIELECTRIC MATERIALS;
ELECTRODES;
ELECTRON BEAM LITHOGRAPHY;
FORMING;
MOSFET DEVICES;
NANOTECHNOLOGY;
PHOTOLITHOGRAPHY;
PLASMA APPLICATIONS;
SEMICONDUCTOR DOPING;
SEMICONDUCTOR INSULATOR BOUNDARIES;
SILICON WAFERS;
THRESHOLD VOLTAGE;
METAL GATE ELECTRODES;
NANOSCALE METAL-OXIDE-SEMICONDUCTOR DEVICES;
PLASMA DOPING (PLAD) TECHNOLOGY;
SILICON-ON-INSULATOR (SOI) WAFER;
SOURCE AND DRAIN EXTENSION(SDE);
MOS DEVICES;
|
EID: 13244267391
PISSN: 10711023
EISSN: None
Source Type: Journal
DOI: 10.1116/1.1813461 Document Type: Conference Paper |
Times cited : (12)
|
References (16)
|