Thermal fatigue life prediction of solder joints using stress analysis

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 204-208

  Mukai, Minoru ^a   Kawakami, Takashi ^a   Takahashi, Kuniaki ^a   Iwase, Nobuo ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTICITY; FATIGUE OF MATERIALS; LSI CIRCUITS; MATHEMATICAL MODELS; SOLDERED JOINTS; STRAIN RATE; STRESS ANALYSIS; THERMAL CYCLING;

BALL GRID ARRAY (BGA) PACKAGES; THERMAL CYCLE TESTS (TCT);

ELECTRONICS PACKAGING;

EID: 0030662909     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)