Measurement of creep and relaxation behaviors of wafer-level CSP assembly using Moiré interferometry

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 282-288

  Ham, Suk Jin ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; FINITE ELEMENT METHOD; INTERFEROMETRY; RELAXATION PROCESSES; SHEAR DEFORMATION; SOLDERED JOINTS; THERMAL LOAD; WSI CIRCUITS;

MOIRE INTERFEROMETRY; THERMAL DEFORMATIONS;

CHIP SCALE PACKAGES;

EID: 0141829894     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1571571     Document Type: Article

References (14)

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