Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 1, 2004, Pages 8-12

  Kim, Ju Youn ^a   Seo, Sangwon ^a   Kim, Do Youl ^a   Jeon, Hyeongtag ^a   Kim, Yangdo ^b  

^a Hanyang University   (South Korea)

^b Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHEMICAL BONDS; CRYSTAL MICROSTRUCTURE; DEPOSITION; DIFFUSION; FILM GROWTH; PLASMA APPLICATIONS; REACTION KINETICS; THERMOOXIDATION; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

DIFFUSION BARRIERS; PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD);

THIN FILMS;

EID: 1242329443     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1624285     Document Type: Article

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