Structural and electrical properties of chemical vapor deposition tungsten overgrowth on physical vapor deposited and metalorganic chemical vapor deposited TiN adhesion layers

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 16, Issue 4, 1998, Pages 2013-2018

  Peng, Y C ^a   Chen, L J ^a   Hsieh, W Y ^b   Yang, Y R ^b   Hsieh, Y F ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001523924     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590122     Document Type: Article

References (14)

1. E. S. Kim, C. M. Lee, J. G. Lee, and H. B. Im, Mater. Sci. Eng., B 17, 137 (1993).
2. S. Kumar, D. R. Chopra, and G. C. Smith, J. Vac. Sci. Technol. B 11, 1815 (1993).
3. Y. Nakasaki, K. Suguro, and M. Kashiwagi, J. Appl. Phys. 64, 3263 (1988).
4. A. J. Konecni, G. A. Dixit, J. D. Luttmer, and R. H. Havemann, Proceedings of the VLSI Multilevel Interconnection Conference, Santa Clara, CA, 1996, p. 181.
5. C. Y. Ting, Thin Solid Films 119, 11 (1984).
6. C. Y. Ting, J. Vac. Sci. Technol. 21, 14 (1992).
7. M. Wittmer and H. Melchoir, Thin Solid Films 93, 397 (1982).
8. M. Wittmer, J. Vac. Sci. Technol. A 2, 273 (1984).
9. M. Biberger, S. Jackson, G. Tkack, J. Schlueter, B. Janes, C. K. Huang, and L. Quellet, Thin Solid Films 270, 522 (1995).
10. A. Katz, A. Feingold, S. J. Pearton, S. Nakahara, M. Ellington, U. K. Chakrabarti, M. Gera, and E. Lane, J. Appl. Phys. 70, 3666 (1991).
11. S. R. Kurtz and R. G. Gordon, Thin Solid Films 140, 277 (1986).
12. I. J. Raaijmakers, Thin Solid Films 247, 85 (1994).
13. J. Pelleg, L. Z. Zevin, S. Lungo, and N. Croitoru, Thin Solid Films 197, 129 (1991).
14. J. E. J. Schmitz, Chemical Vapor Deposition of Tungsten and Tungsten Silicides (Noyes, Park Ridge, NJ, 1992), p. 107.