Characteristics of TiN films deposited by remote plasma-enhanced atomic layer deposition method

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 42, Issue 4 B, 2003, Pages

  Kim, Ju Youn ^a   Kim, Yangdo ^b   Jeon, Hyeongtag ^a  

^a Hanyang University   (South Korea)

^b Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; GASES; NITROGEN; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; SILICA; THERMOOXIDATION; THIN FILMS; TITANIUM;

DIFFUSION BARRIER THIN FILMS; PLASMA ENHANCED ATOMIC LAYER DEPOSITION; TITANIUM NITRIDE FILMS;

TITANIUM NITRIDE;

EID: 0037594174     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.l414     Document Type: Letter

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