Short-timescale thermal mapping of semiconductor devices

IEEE Electron Device Letters

Volumn 18, Issue 5, 1997, Pages 169-171

  Ju, Y S ^a,b   Kading O W ^b,c   Leung, Y K ^a,b   Wong, S S ^a,b   Goodson, K E ^a,b  

^a IEEE   (United States)

^b Stanford University   (United States)

^c TEMIC TELEFUNKEN Microlectron GmbH ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DISCHARGES; MOSFET DEVICES; TEMPERATURE MEASUREMENT; THERMAL GRADIENTS;

THERMAL MAPPING;

SEMICONDUCTOR DEVICES;

EID: 0031139570     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.568750     Document Type: Article

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