Use of TiN(O)Ti as an effective intermediate stress buffer and diffusion barrier for Cu/parylene-n interconnects

Applied Physics Letters

Volumn 79, Issue 20, 2001, Pages 3260-3262

  Gadre, Kaustubh S ^a   Alford, T L ^a   Mayer, J W ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039741511     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1416156     Document Type: Article

References (15)

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