The evaluation of Young's modulus and residual stress of nickel films by microbridge testings

Measurement Science and Technology

Volumn 15, Issue 12, 2004, Pages 2389-2394

  Zhou, Z M ^a   Zhou, Y ^a   Yang, C S ^a   Chen, J A ^a   Ding, G F ^a   Ding, W ^a   Wang, M J ^a   Zhang, Y M ^a  

^a Shanghai Jiao Tong University   (China)

Author keywords

Mechanical properties; Microbridge testing; Nanoindenter; Nickel films

Indexed keywords

DEFORMATION; ELASTIC MODULI; INDENTATION; METALLIC FILMS; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES; THICKNESS MEASUREMENT; YIELD STRESS;

DEFLECTION THEORY; MICROBRIDGE TESTING; NANOINDENTATOR SYSTEM; NICKEL FILMS;

NICKEL;

MEASUREMENT METHOD;

EID: 10944270184     PISSN: 09570233     EISSN: None     Source Type: Journal    
DOI: 10.1088/0957-0233/15/12/006     Document Type: Article

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