The effect of deposition parameters and substrate surface condition on texture, morphology and stress in magnetron-sputter-deposited Cu thin films

Thin Solid Films

Volumn 474, Issue 1-2, 2005, Pages 50-63

  Okolo, B ^a   Lamparter, P ^a   Welzel, U ^a   Wagner, T ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Copper films; Stress; Texture; X ray diffraction

Indexed keywords

COPPER; ION BEAMS; MAGNETRON SPUTTERING; MORPHOLOGY; SPUTTER DEPOSITION; STRESSES; SURFACE TREATMENT; TEXTURES; X RAY DIFFRACTION ANALYSIS;

COPPER FILMS; FOCUSED ION BEAMS (FIB); STRUCTURE ZONE MODEL (SZM); THERMAL MISMATCH;

THIN FILMS;

EID: 10844271519     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.08.006     Document Type: Article

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