Microstructure evolution of tin-lead solder

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 635-642

  Ubachs, René L J M ^a   Schreurs, Piet J G ^a   Geers, Marc G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Solder joints; Tin lead solder

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; DIFFUSION; FINITE ELEMENT METHOD; FREE ENERGY; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING ALLOYS;

CAHN-HILLIARD MODEL; COMPUTATIONAL EFFICIENT ALGORITHM; DIFFUSE INTERFACE MODEL; TIN LEAD SOLDER;

TIN ALLOYS;

EID: 10244247703     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838908     Document Type: Article

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