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Volumn 74, Issue 2, 2000, Pages 215-231

Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE TESTING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY; THERMAL CYCLING; THERMAL EXPANSION; VIBRATIONS (MECHANICAL); VISCOPLASTICITY;

EID: 0033883033     PISSN: 00457949     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0045-7949(99)00028-0     Document Type: Article
Times cited : (30)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.